Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding

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dc.authorid0000-0003-0042-5044
dc.authorid0000-0002-5940-7345
dc.authorid0000-0002-3204-6746
dc.authorid0000-0003-1626-5858
dc.contributor.authorMehdipour, Mostafa
dc.contributor.authorDogan, Semih
dc.contributor.authorHezarkhani, Marjan
dc.contributor.authorDericiler, Kuray
dc.contributor.authorArik, Muhammet Nasuh
dc.contributor.authorYildirim, Cennet
dc.contributor.authorBeylergil, Bertan
dc.date.accessioned2026-01-24T12:30:50Z
dc.date.available2026-01-24T12:30:50Z
dc.date.issued2025
dc.departmentAlanya Alaaddin Keykubat Üniversitesi
dc.description.abstractEstablishing a robust interfacial bond between hexagonal boron nitride (h-BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h-BN's low-surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h-BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of activated h-BN in order to make it more compatible with the epoxy matrix. X-ray photoelectron spectroscopy analysis revealed silicon peaks (Si2s peak at 150.1 eV and Si2p peak at 100.3 eV) in the spectrum of silane-treated samples. Heat treatment resulted in the production of more oxygen molecules on the shell of h-BN compared to the acid treatment. Here, the primary focus was on examining how surface treatment affects thermal conductivity (TC) performance in both in-plane and through-thickness paths. There was an increase in the epoxy's TC perpendicular to the plane, going from 0.21 to 0.47 (W/mK), showing a remarkable 123.8% enhancement by adding 10 wt% of silane-modified-thermal treated h-BN particles. The improvement resulted from effectively silanizing the exterior boundary of h-BN particles, enhancing connection and distribution in the epoxy matrix. Surface modification of h-BN-epoxy composites improves TC, leading to better heat conduction in thermal management systems, benefiting industries like aerospace, automotive, and energy systems.Highlights Silanization of h-BN for better filler-matrix bonding leading to improved heat transfer Boosting thermal conductivity in the through-thickness direction with surface-modified h-BN Significant improvement in through-thickness thermal conductivity with treated h-BN. Thermal treatment of h-BN produced better oxygenation than acid treatment. Application in aerospace and automotive through improved heat transfer. h-BN functionalization route for higher thermal conductivity. image
dc.description.sponsorshipUlusal Bor Arascedil;timath;rma Enstits [2020-31-07-15-002]; Turkish Energy Nuclear and Mineral Research Agency-National Boron Research Institute
dc.description.sponsorshipThe Turkish Energy Nuclear and Mineral Research Agency-National Boron Research Institute (TENMAK-BOREN) is providing support for this project under project number 2020-31-07-15-002.
dc.identifier.doi10.1002/pc.29136
dc.identifier.endpage2755
dc.identifier.issn0272-8397
dc.identifier.issn1548-0569
dc.identifier.issue3
dc.identifier.scopus2-s2.0-85205912803
dc.identifier.scopusqualityQ1
dc.identifier.startpage2740
dc.identifier.urihttps://doi.org/10.1002/pc.29136
dc.identifier.urihttps://hdl.handle.net/20.500.12868/5476
dc.identifier.volume46
dc.identifier.wosWOS:001326575400001
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherWiley
dc.relation.ispartofPolymer Composites
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_WoS_20260121
dc.subjectepoxy
dc.subjecthexagonal boron nitride
dc.subjectsurface functionalization
dc.subjectthermal conductivity
dc.titleEnhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding
dc.typeArticle

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