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    A comprehensive experimental study on the effects of hexagonal boron nitride particle size and loading ratio on thermal and mechanical performance in epoxy composites
    (Sage Publications Ltd, 2024) Ozyigit, Samet; Mehdipour, Mostafa; Al-Nadhari, Abdulrahman; Tabrizi, Arvin T.; Dogan, Semih; Dericiler, Kuray; Beylergil, Bertan
    Harnessing the potential of hexagonal boron nitride (h-BN) in epoxy composites for tailoring thermal conductivity is a promising avenue in materials science. However, achieving balanced enhancements in both in-plane and through-plane directions remains a challenge that requires innovative solutions. The primary objective of this research is to evaluate how thermal and mechanical characteristics of an epoxy matrix are affected by the size and amount of h-BN particles. To achieve this goal, h-BN particles with varying sizes (micro and nano) are incorporated into the epoxy matrix at different weight ratios spanning from 0.5 wt % to 20 wt % using a pre-dispersion technique. The epoxy composites reinforced with h-BN through a molding process exhibits enhanced mechanical and thermal performance in contrast to the pristine epoxy material. During the flexural test, acoustic emission data is collected to identify the initiation and progression of damage within the specimens under testing conditions. The most notable enhancement in thermal conductivity is observed when incorporating 20 wt% of micron-sized h-BN particles. This leads to a remarkable 107% increase in the in-plane direction and an impressive 112% increase in the through-plane direction. These results can be attributed to the formation of a three-dimensional thermally conductive network by the larger h-BN particles, which extends the path of phonon scattering. Furthermore, there are significant improvements in both flexural modulus and tensile modulus. Epoxy composites containing 10 wt% of micron-sized h-BN experiences an approximate 42% increase, while those with 20 wt% of the same particles displays a substantial 47% rise in these properties. This study effectively addresses the challenges associated with tailoring the thermal properties of epoxy composites, opening up new opportunities for applications in various industries, including electronics, aerospace and thermal management systems. Graphical Abstract
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    Öğe
    Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding
    (Wiley, 2025) Mehdipour, Mostafa; Dogan, Semih; Hezarkhani, Marjan; Dericiler, Kuray; Arik, Muhammet Nasuh; Yildirim, Cennet; Beylergil, Bertan
    Establishing a robust interfacial bond between hexagonal boron nitride (h-BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h-BN's low-surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h-BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of activated h-BN in order to make it more compatible with the epoxy matrix. X-ray photoelectron spectroscopy analysis revealed silicon peaks (Si2s peak at 150.1 eV and Si2p peak at 100.3 eV) in the spectrum of silane-treated samples. Heat treatment resulted in the production of more oxygen molecules on the shell of h-BN compared to the acid treatment. Here, the primary focus was on examining how surface treatment affects thermal conductivity (TC) performance in both in-plane and through-thickness paths. There was an increase in the epoxy's TC perpendicular to the plane, going from 0.21 to 0.47 (W/mK), showing a remarkable 123.8% enhancement by adding 10 wt% of silane-modified-thermal treated h-BN particles. The improvement resulted from effectively silanizing the exterior boundary of h-BN particles, enhancing connection and distribution in the epoxy matrix. Surface modification of h-BN-epoxy composites improves TC, leading to better heat conduction in thermal management systems, benefiting industries like aerospace, automotive, and energy systems.Highlights Silanization of h-BN for better filler-matrix bonding leading to improved heat transfer Boosting thermal conductivity in the through-thickness direction with surface-modified h-BN Significant improvement in through-thickness thermal conductivity with treated h-BN. Thermal treatment of h-BN produced better oxygenation than acid treatment. Application in aerospace and automotive through improved heat transfer. h-BN functionalization route for higher thermal conductivity. image